TERMIUM Plus®

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potting compound [1 record]

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Filter results by subject field

Alphabetical list of terms

Record 1 2000-11-24

English

Subject field(s)
  • Electrical Engineering
DEF

A sealing material used to fill the case or enclosure in which a component is contained.

CONT

The encapsulating material holds the components in position and thus aids the manufacture of complex circuitry for computers, aerospace equipment, etc. The materials used for this purpose are also called potting compounds; among them are polyurethane, epoxy, and polyester resins.

French

Domaine(s)
  • Électrotechnique
DEF

Résine non polymérisée ou autre matière isolante à l'état liquide utilisée pour l'enrobage en boîtier.

CONT

Tout le composant est enfermé dans une matière plastique époxyde ou dans un boîtier métallique garni d'un matériau de remplissage inerte. Cet enrobage est nécessaire pour obtenir la robustesse mécanique et empêcher l'humidité de contaminer le semi-conducteur.

Spanish

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TERMIUM Plus®, the Government of Canada's terminology and linguistic data bank
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